In haptic lens over-assemble thin silicon wafer

In haptic lens over-assemble thin silicon wafer

  • CN 104,838,308 B
  • Filed: 09/11/2013
  • Issued: 08/23/2019
  • Est. Priority Date: 09/26/2012
  • Status: Active Grant
First Claim
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1. a kind of method that manufacture has the haptic lens of IC chip, comprising:

  • Multiple chip contact pads are created on the chip by forming the grid of metal wire on the surface of the chip, wherein instituteState crosspoint of the chip contact pad corresponding to the metal wire in the grid;

    Apply assembling grafting material to each of multiple substrate contact pads formed on the substrate material of haptic lens;

    The multiple chip contact pad is engaged to the multiple substrate contact pad with will be described via the assembling grafting materialChip is joined to the substrate material;

    AndThe chip of the substrate material and engagement on it is embedded into the material for be used for haptic lens to form haptic lens.

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