Plating solution formula and electroplating method for plating compact rhenium film on copper substrate

Plating solution formula and electroplating method for plating compact rhenium film on copper substrate

  • CN 104,846,408 A
  • Filed: 05/13/2015
  • Published: 08/19/2015
  • Est. Priority Date: 05/13/2015
  • Status: Active Application
First Claim
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1. one kind is plated the electroplate liquid formulation of fine and close rhenium film on Copper substrate, it is characterized in that:

  • described formula comprises;

    gelatin 1 ~ 5g/L, vanillin food grade,1000.000000ine mesh 0.5 ~ 3mM, sodium lauryl sulphate 0.5 ~ 2mM, citric acid 100 ~ 500mM, nickel sulfamic acid 30 ~ 70mM, ammonium perrhenate 30 ~ 70mM, sodium hydroxide 5M, plating solution pH=4.0-6.0.

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