Wiring substrate and method of making wiring substrate

Wiring substrate and method of making wiring substrate

  • CN 104,902,682 A
  • Filed: 03/02/2015
  • Published: 09/09/2015
  • Est. Priority Date: 03/05/2014
  • Status: Active Application
First Claim
Patent Images

1. a wiring substrate, comprises:

  • Stratum nucleare, its through-thickness is formed with through hole, and has from the inwall of the described through hole jut outstanding to the inner side of described through hole;

    Multiple electronic device, it is disposed side by side on the inside of described through hole separated from each other in plan view, and has sidepiece, and described sidepiece engages with described protuberance;

    AndResin bed, it is filled in the inside of described through hole, and supports described electronic device.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×