Cavity forming method and manufacturing method of sensor chip, chip and electronic equipment

Cavity forming method and manufacturing method of sensor chip, chip and electronic equipment

  • CN 104,925,745 A
  • Filed: 04/28/2015
  • Published: 09/23/2015
  • Est. Priority Date: 04/28/2015
  • Status: Active Application
First Claim
Patent Images

1. , for the formation of a method for the cavity in pressure sensor for micro electro-mechanical system chip, comprising:

  • Substrate is formed the first groove;

    Cover layer is bonded on substrate, to cover the first groove, thus forms cavity;

    AndCover layer is etched, to reduce overburden cover.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×