Copper plating liquid and process for direct cyanide-free acid copper plating on steel substrate

Copper plating liquid and process for direct cyanide-free acid copper plating on steel substrate

  • CN 104,975,311 A
  • Filed: 07/01/2015
  • Published: 10/14/2015
  • Est. Priority Date: 07/01/2015
  • Status: Active Application
First Claim
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1. direct without a cyanogen acid copper-plating plating solution on steel substrate, it is characterized in that:

  • comprise copper sulfate, sulfuric acid, deionized water, chlorion, go out photo etching, activator and complexing agent;

    Described concentration of copper sulfate is 50-200g/L;

    Described sulfuric acid concentration is 20-80g/L;

    Described chlorine ion concentration is 0.02-0.08g/L;

    Deionized water 400-900g;

    Described go out the concentration of photo etching be 5-50g/L;

    The concentration of described activator is 10-100g/L;

    The concentration of described complexing agent is 10-100g/L.

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