Camera module support molded based on metal powder, and manufacturing method and application thereof

Camera module support molded based on metal powder, and manufacturing method and application thereof

  • CN 104,994,259 A
  • Filed: 06/26/2015
  • Published: 10/21/2015
  • Est. Priority Date: 06/26/2015
  • Status: Active Application
First Claim
Patent Images

1. a camera module for thickness reduction, is characterized in that, comprising:

  • One wiring board;

    At least one sensitive chip, every described sensitive chip is electrically connected on described wiring board respectively;

    AndOne camera module support, it is obtained by metal dust or metal dust and non-metal powder mixture, described wiring board is mounted on described camera module support, wherein said camera module support is used for the heat conduction of every described sensitive chip generation when carrying out photoelectric conversion and is radiated to the external environment condition of described camera module support, thus described camera module does not need to configure extra heat abstractor at described wiring board, to reduce the thickness of described camera module in axis.

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