Light emitting device, light-emitting component installation method and light-emitting component mounting device

Light emitting device, light-emitting component installation method and light-emitting component mounting device

  • CN 105,009,314 B
  • Filed: 02/26/2014
  • Issued: 11/05/2019
  • Est. Priority Date: 02/27/2013
  • Status: Active Grant
First Claim
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1. a kind of light-emitting component installation method installs light-emitting component, feature in the light-emitting component installation method on substrateIt is,The light-emitting component installation method includes following process:

  • It will be provided with that there is the LED chip of upper surface to shine with the described of luminescent coating that the light emitting side in the LED chip is arrangedJointing material mounting of the element across the anisotropic conductive material being set on the substrate;

    The side of the luminescent coating of the light-emitting component after making guiding mechanism and mounting abuts, and makes under the guiding mechanismPosition of the surface positioned at the upper surface compared to the LED chip on the lower, and make the jointing material and the guiding mechanismIn the state of following table face contact, solidify the jointing material,The upper surface of the jointing material around the light-emitting component be it is flat and in the height direction be located at compareThe position of the upper surface of the LED chip on the lower,Be located at the upper surface position against the top compared to the LED chip the luminescent coating side from the bonding materialThe mode that material exposes configures the LED chip,The substrate includes;

    substrate;

    Connection electrode is formed on the substrate;

    And substrate light reflecting member layer, shapeAt on the substrate except the link position for removing the LED chip.

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