Chemical mechanical polishing pads

Chemical mechanical polishing pads

  • CN 105,014,528 B
  • Filed: 04/20/2015
  • Issued: 09/25/2018
  • Est. Priority Date: 04/25/2014
  • Status: Active Grant
First Claim
Patent Images

1. a kind of chemical mechanical polishing pads, it includes:

  • Polishing layer with polished surface, wherein the polishing layer includes the reaction product of ingredient below:

    The isocyanate-terminated carbamate prepolymer of unreacted NCO group with 8.5 to 9.5 weight %;

    WithCurative system, it includes:

    The high molecular weight polyols curing agent of 10 to 60 weight %, wherein the high molecular weight polyols curing agent has 2,500To 100,000 number average molecular weight MN

    And the wherein described high molecular weight polyols curing agent per molecule has average 5 to arrive7 hydroxyls;

    WithBifunctional curing dose of 40 to 90 weight %;

    The polishing layer shows more than 0.6g/cm3Density;

    40 to 60 Shore D hardness;

    125 to 300% elongation at break;

    1.5 to 4 G'"'"'30/90 ratios;

    The stretch modulus of 100 to 300 (MPa);

    The wet type rate of cutting of 4 to 10 μ

    m/min;

    With >

    =28The ratio between 300mm TEOS removal rates and Shore D hardness=(TEOS300-RR/ Shore D hardness).

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