Stacked Dies With Wire Bonds and Method

Stacked Dies With Wire Bonds and Method

  • CN 105,047,620 A
  • Filed: 04/28/2015
  • Published: 11/11/2015
  • Est. Priority Date: 04/30/2014
  • Status: Active Application
First Claim
Patent Images

1. a semiconductor device, comprising:

  • First tube core;

    Second tube core, is attached to described first tube core;

    3rd tube core, is attached to described second tube core and is positioned at the side relative with described first tube core of described second tube core;

    Closing line, is electrically connected to described first tube core by described 3rd tube core;

    Sealant, seal described second tube core and described 3rd tube core and with the first surface physical contact of described first tube core;

    AndFirst joint outer part, to extend in described sealant and to be electrically connected with described 3rd tube core.

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