The wettable plating in side for semiconductor chip packaging

The wettable plating in side for semiconductor chip packaging

  • CN 105,097,563 B
  • Filed: 08/09/2011
  • Issued: 10/18/2019
  • Est. Priority Date: 08/09/2010
  • Status: Active Grant
First Claim
Patent Images

1. a kind of conductive strips used in electrolytic plating process, it includes:

  • The backing of conductive metallization;

    Adhesive is placed on the backing of the metallization;

    AndMultiple conducting particles, are embedded in described adhesive, and the multiple conducting particles is electrically connected to the back of the metallizationLining.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×