Organic light emitting diode package method and package structure and device containing structure

Organic light emitting diode package method and package structure and device containing structure

  • CN 105,098,099 A
  • Filed: 06/16/2015
  • Published: 11/25/2015
  • Est. Priority Date: 06/16/2015
  • Status: Active Application
First Claim
Patent Images

1. a method for packing for Organic Light Emitting Diode, comprising:

  • Arrange first substrate, described first substrate is made up of metal forming;

    Be provided with OLED on the first substrate;

    Passivation layer is set, for covering described Organic Light Emitting Diode;

    Whole described first substrate applies packaging plastic, and described packaging plastic covers described passivation layer;

    At least the second transparency carrier is set in the part of the described passivation layer of the covering of described packaging plastic;

    WithCure package glue, forms the encapsulation of described Organic Light Emitting Diode.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×