Selective electroless gold plating process for printed circuit boards

Selective electroless gold plating process for printed circuit boards

  • CN 105,142,353 A
  • Filed: 06/12/2015
  • Published: 12/09/2015
  • Est. Priority Date: 06/12/2015
  • Status: Active Application
First Claim
Patent Images

1. a printed substrate selective immersion process, is characterized in that, comprises the following steps:

  • 1) make half tone, carry out silk screen graphic designs,2) the first surface silk screening ink of pcb board;

    After the registration holes accurate contraposition of the half tone made and pcb board to be printed, pcb board is placed into first surface silk screening ink character printer carrying out pcb board;

    3) baking sheet;

    4) second silk screening ink of pcb board;

    5) baking sheet;

    6) gold is changed;

    7) film is taken off.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×