Organic film chemical and mechanical grinding paste material constituent and the grinding method for using it

Organic film chemical and mechanical grinding paste material constituent and the grinding method for using it

  • CN 105,143,390 B
  • Filed: 04/17/2014
  • Issued: 08/13/2019
  • Est. Priority Date: 04/17/2013
  • Status: Active Grant
First Claim
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1. a kind of CMP slurry constituent, for grinding organic film, comprising:

  • At least one of polar solvent and nonpolar solvent;

    Metal oxide abrasive;

    AndOxidant is cerium ammonium salt,Wherein the CMP slurry constituent is acidity, and the organic film contains the carbon of 50 atom % to 95 atom %,Wherein the CMP slurry constituent has 1.9 or smaller pH value,Wherein the oxidant is present in the CMP slurry constituent with the amount of 0.001 weight % to 1 weight %,The organic film has the film density and 0.4GPa or bigger of 0.5 g/cubic centimeter to 2.5 g/cubic centimeterHardness.

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