Semiconductor device

Semiconductor device

  • CN 105,144,373 A
  • Filed: 12/26/2013
  • Published: 12/09/2015
  • Est. Priority Date: 03/15/2013
  • Status: Active Application
First Claim
Patent Images

1. a semiconductor device, is characterized in that, has:

  • Metal parts, it is equipped with semiconductor element in a face;

    Metallic plate, it is configured at the another side side of described metal parts via insulating barrier;

    Printing distributing board, it is equipped with the electric component be electrically connected with described semiconductor element;

    AndPotting resin, described metal parts, described printing distributing board and described metallic plate encapsulate by integratedly, and coefficient of linear expansion is 15 ~ 23 ×

    10

    6
    (1/K).

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×