Integrated module stacking structure and electronic equipment

Integrated module stacking structure and electronic equipment

  • CN 105,206,602 B
  • Filed: 06/16/2014
  • Issued: 07/24/2020
  • Est. Priority Date: 06/16/2014
  • Status: Active Grant
First Claim
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1. An integrated module stack structure, comprising:

  • a first integrated module including a first substrate and a first chip fixed on the first substrate;

    the first substrate is provided with a wiring electrically connected with the pins of the first chip;

    the first substrate is provided with one or more data transmission points of the first chip, and the data transmission points of the first chip are electrically connected with the wiring of the first substrate;

    a second integrated module including a second substrate and a second chip fixed on the second substrate;

    the second substrate is provided with a wiring electrically connected with the pins of the second chip;

    one or more data transmission points of the second chip are arranged on the second substrate, and the data transmission points of the second chip are electrically connected with the wiring of the second substrate;

    the connecting layer is arranged between the first integrated module and the second integrated module, wiring is arranged on the connecting layer, and the wiring of the connecting layer is arranged according to the positions of the data transmission points of the first chip and the data transmission points of the second chip.

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