Sputtering target/backing plate assembly

Sputtering target/backing plate assembly

  • CN 105,209,657 A
  • Filed: 10/29/2014
  • Published: 12/30/2015
  • Est. Priority Date: 11/06/2013
  • Status: Active Application
First Claim
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1. a sputtering/backing plate assembly, it is the sputtering target/backing plate assembly that backing plate sputtering target and coefficient of thermal expansion being greater than this sputtering target engages and obtain, it is characterized in that, sputtering target comprises the Ta of 0.2% yielding stress with 150 ~ 200MPa, and backing plate comprises the Cu alloy of 0.2% yielding stress with 60 ~ 200MPa.

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