Semiconductor processing device and process method for processing semiconductor workpiece

Semiconductor processing device and process method for processing semiconductor workpiece

  • CN 105,225,982 B
  • Filed: 05/30/2014
  • Issued: 07/28/2020
  • Est. Priority Date: 05/30/2014
  • Status: Active Grant
First Claim
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1. The utility model provides a semiconductor processing device, includes process chamber, sealed lid, liquid medicine supply tube, wafer chuck, lotion feed tube and temperature control system, its characterized in that, semiconductor processing device'"'"'s process chamber externally mounted has the heating source, the liquid medicine supply tube outsourcing has pipeline heating device, the wafer chuck has built-in heater, temperature control system gathers the temperature data on liquid medicine and wafer surface, temperature control system controls heating source, built-in heater and pipeline heating device alone, keeps the temperature difference of the temperature of this liquid medicine and the temperature on wafer surface at the wet etching process stage in 1 ℃

  • of the within range, promotes wafer temperature to more than 80 ℃

    at the drying stage.

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