Layering medium for transfer and printed matter

Layering medium for transfer and printed matter

  • CN 105,246,705 A
  • Filed: 05/30/2014
  • Published: 01/13/2016
  • Est. Priority Date: 05/31/2013
  • Status: Active Application
First Claim
Patent Images

1. a transfer printing stacked dielectric, it wraps the transfer printing sandwich with the minute concave-convex structure portion of micro concavo-convex shape in being formed on transfer printing body by thermoprint, it is characterized in that having:

  • Support base material,Be formed at the laminating layer on this support base material,The minute concave-convex structure portion with micro concavo-convex shape on this laminating layer andBe formed at the adhesive linkage in this minute concave-convex structure portion, wherein,Described minute concave-convex structure portion is spaced apart and be individually formed in the mode in the region being enclosed in thermoprint transfer printing to be used.

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