Solution for preventing bridging of electroless metal coat, and method for manufacturing printed wiring board using same

Solution for preventing bridging of electroless metal coat, and method for manufacturing printed wiring board using same

  • CN 105,264,114 A
  • Filed: 05/12/2014
  • Published: 01/20/2016
  • Est. Priority Date: 06/18/2013
  • Status: Active Application
First Claim
Patent Images

1. , without an anti-bridge joint liquid for electrolytic metal plating, it is characterized in that, containing poly-thiol compound.

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