Expanding thermal plasma deposition system

Expanding thermal plasma deposition system

  • CN 105,296,965 A
  • Filed: 03/08/2005
  • Published: 02/03/2016
  • Est. Priority Date: 03/09/2004
  • Status: Active Application
First Claim
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1. , with the system of the performance of overall average coating large area substrates, comprising:

  • Base material is positioned at deposition chamber wherein, and described chamber maintains under negative pressure;

    The two or more expanding thermal plasma sources be connected with described deposition chamber, each expanding thermal plasma source comprises the anode with hole, and described expanding thermal plasma source produces the plasma jet with central shaft;

    WithAt least one syringe, it is separated with described expanding thermal plasma source and will evaporates to form the coating deposited on the substrate in reagent injection to described plasma, and the injection of described reaction reagent is positioned at the distance that the anode apart from described expanding thermal plasma source specifies;

    Wherein said evaporation reaction reagent is the injection orifice injection of 0.1 to 4 inch diameter by the hole be positioned at apart from described expanding thermal plasma source;

    Wherein said syringe be have many holes current collector (ringmanifold), there is the racetrack collector (racetrackmanifold) in many holes or there is the straight tube manifold in many holes.

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