Semiconductor substrate, semiconductor package structure and manufacturing method thereof

Semiconductor substrate, semiconductor package structure and manufacturing method thereof

  • CN 105,304,602 A
  • Filed: 07/18/2014
  • Published: 02/03/2016
  • Est. Priority Date: 07/18/2014
  • Status: Active Application
First Claim
Patent Images

1. a Semiconductor substrate, it comprises:

  • First dielectric layer, described first dielectric layer has multiple opening;

    Multiple connection pad, described in each, multiple connection pad lays respectively in multiple opening described in each, and described multiple connection pad has first surface and the second surface relative to described first surface, and the area of described first surface is less than the area of described second surface,Described multiple opening appears described second surface;

    Patterned metal layer, described patterned metal layer to be arranged on described first dielectric layer and to extend to described multiple opening to contact the first surface of described multiple connection pad;

    AndSecond dielectric layer, described second dielectric layer is coated and appear the described patterned metal layer of part.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×