Pressure-sensing rollers for lamination systems

Pressure-sensing rollers for lamination systems

  • CN 105,307,786 A
  • Filed: 06/18/2013
  • Published: 02/03/2016
  • Est. Priority Date: 06/18/2013
  • Status: Active Application
First Claim
Patent Images

1. , for a package system for electronic equipment display, comprising:

  • For the clearer of the surface removal chip from substrate;

    Be couple to the pressure sensor of described clearer;

    The computing equipment of pressure signal is received from described pressure sensor;

    WithBe couple to the computer-controlled positioning equipment of described clearer, wherein said computing equipment is configured to indicate described computer-controlled positioning equipment to move described clearer based on received pressure data.

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