Method for manufacturing back contact solar cell module

Method for manufacturing back contact solar cell module

  • CN 105,324,854 A
  • Filed: 01/07/2015
  • Published: 02/10/2016
  • Est. Priority Date: 01/08/2014
  • Status: Active Application
First Claim
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1. a manufacture method for the solar module of back-contact, it comprises:

  • First arrangement step, use surface to have resin molding that the flexible printing substrate of cloth line electrode or surface have cloth line electrode, is optionally configured on the described cloth line electrode of described flexible printing substrate or described resin molding by the electric conducting material containing electroconductive particle and adhesive resin;

    Bonding process, surface is used to have the solar battery cell of electrode, and described solar battery cell and described flexible printing substrate or described resin molding are fitted, and the described electrode of described solar battery cell is electrically connected by described electroconductive particle with the described cloth line electrode of described flexible printing substrate or described resin molding;

    Or,The manufacture method of the solar module of described back-contact comprises;

    First arrangement step, uses surface to have the solar battery cell of electrode, and is optionally configured on the described electrode of described solar battery cell by the electric conducting material containing electroconductive particle and adhesive resin;

    Bonding process, use surface to have resin molding that the flexible printing substrate of cloth line electrode or surface have cloth line electrode, and described solar battery cell and described flexible printing substrate or described resin molding are fitted, and the described electrode of described solar battery cell is electrically connected by described electroconductive particle with the described cloth line electrode of described flexible printing substrate or described resin moldingAs described electroconductive particle, use the electroconductive particle having substrate particle and be configured in the conductive part on described substrate particle surface, the outer surface of described conductive part has multiple projection.

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