Wiring substrate

Wiring substrate

  • CN 105,336,709 A
  • Filed: 08/05/2015
  • Published: 02/17/2016
  • Est. Priority Date: 08/05/2014
  • Status: Active Application
First Claim
Patent Images

1. a circuit board, is characterized in that,This circuit board comprises:

  • Insulative substrate, it has the lift-launch region of electronic device in front, and the profile of this insulative substrate is rectangle when overlooking;

    The framework of rectangle, it is arranged on around described insulative substrate front in the mode of surrounding described lift-launch region, forms the recess for holding described electronic device;

    Via hole, it is formed in the corner part of described framework, runs through described framework in a thickness direction, and the diameter of this via hole is less than 100 μ

    m;

    Via conductor, it is filled in described via hole, and the internal face of the described framework of recess described in self-forming does not expose;

    AndThe metal layer of sealing, it is formed in the upper surface of described framework, is electrically connected with described via conductor,When overlooking, the described corner part of described framework is the wide portion that width is widened towards described lift-launch region, and the width of the part except described corner part of described framework is less than 150 μ

    m,The internal face linearly shape in described wide portion when overlooking, the internal face in described wide portion and described framework and the angle that formed between the internal face that the internal face in described wide portion is adjacent be obtuse angle.

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