High dielectric thermosetting resin composition and laminated board for substrate

High dielectric thermosetting resin composition and laminated board for substrate

  • CN 105,385,107 A
  • Filed: 12/07/2015
  • Published: 03/09/2016
  • Est. Priority Date: 12/07/2015
  • Status: Active Application
First Claim
Patent Images

1. a high dielectric substrate compositions of thermosetting resin, it is characterized in that comprising 300 ~ 550 parts of high-k fillers and 100 parts of organic solids, 100 parts of organic solids comprise:

  • Composition epoxy resin;

    30 ~ 50 parts;

    Active ester solidifying agent;

    18 ~ 35 parts;

    Bimaleimide resin;

    4 ~ 15 parts;

    Cyanate modified polyphenylene oxide resin;

    4 ~ 20 parts;

    Promotor Dimethylamino pyridine;

    0.01 ~ 2 part.

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