Novel substrate package LED full-color method

Novel substrate package LED full-color method

  • CN 105,428,496 A
  • Filed: 09/19/2014
  • Published: 03/23/2016
  • Est. Priority Date: 09/19/2014
  • Status: Active Application
First Claim
Patent Images

1. the full-color method of novel base plate packaging LED, is characterized in that, comprising:

  • substrate (1);

    Be arranged at the circuit-line (2) on described substrate (1), described circuit-line (2) comprises two parts;

    the front-side circuit circuit (21) and the back-side circuit circuit (22) that are positioned at described substrate (1) obverse and reverse;

    Be arranged on described substrate (1), and for connecting the conductive hole (3) of described front-side circuit circuit (21) and described back-side circuit circuit (22), described conductive hole (3) extends to described back-side circuit circuit (22) from described front-side circuit circuit (21), and is filled up sealing by conducting metal material and fill and lead up;

    Be placed on the LED luminescence chip (4) on described front-side circuit circuit (21);

    For encapsulating the packaging plastic (5) of described LED luminescence chip (4).A kind of full-color method of novel base plate packaging LED specifically comprises the following steps;

    A. the cleaning of substrate;

    B. die bond primer thaws;

    C. by the expansion of LED luminescence chip spacing evenly, fix on substrate by bonder and die bond primer nation;

    D. nation is fixed on LED luminescence chip on substrate by bonding equipment, be connected with the pad on substrate with bonding line;

    E. in the case of a high temperature by model machine, the LED luminescence chip on protective substrate is carried out with packaging plastic and substrate front side compression molding.

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