Atomic layer deposition equipment

Atomic layer deposition equipment

  • CN 105,463,406 A
  • Filed: 09/04/2014
  • Published: 04/06/2016
  • Est. Priority Date: 09/04/2014
  • Status: Active Application
First Claim
Patent Images

1. an atomic layer deposition apparatus, is characterized in that, this atomic layer deposition apparatus comprises:

  • Transfer chamber;

    The pre-cleaning chamber be communicated with described transfer chamber respectively, thermal chamber, loading lock and multiple reaction chamber;

    The front-end module be communicated with described loading lock;

    Wherein, in described multiple reaction chamber via the reaction of process gas by the surface of ald in base material;

    Be equipped with mechanical arm for transmitting base material at described transfer chamber with between pre-cleaning chamber, thermal chamber, loading lock and multiple reaction chamber in described transfer chamber;

    Described front-end module is configured as automatically and between described loading lock transmitting base material.

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