Zip-top can quick-cooling device based on semiconductor refrigeration

Zip-top can quick-cooling device based on semiconductor refrigeration

  • CN 105,466,152 A
  • Filed: 12/22/2015
  • Published: 04/06/2016
  • Est. Priority Date: 12/22/2015
  • Status: Active Application
First Claim
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1. a pop can quick cooler for based semiconductor refrigeration, is characterized in that, primarily of pop can, imitative type aluminium cover, cool guiding block, semiconductor chilling plate, heat-conducting block, insulation material and heat abstractor composition;

  • Described imitative type aluminium cover outer wall is hollow cylinder, upper opening, and bottom is closed, and hollow parts shape is consistent with pop can profile, pop can be placed on hollow in, bottom overlapping with imitative type aluminium;

    It is cotton that imitative type aluminium cover periphery is provided with one deck protection, and described protection cotton is cylinder type hollow jacket layer, protects cotton material to be adiabatic cotton;

    Described cool guiding block is close to described imitative type aluminium cover bottom;

    The cold junction of described semiconductor chilling plate is close to described cool guiding block lower surface, and described heat-conducting block upper surface is close in hot junction, and all wraps up with the muff that adiabatic cotton makes around described cooling piece and described cool guiding block;

    Described heat-conducting block is connected with heat abstractor.

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