Manufacturing method for pre-packaged lead frame

Manufacturing method for pre-packaged lead frame

  • CN 105,470,232 A
  • Filed: 12/30/2015
  • Published: 04/06/2016
  • Est. Priority Date: 12/30/2015
  • Status: Active Application
First Claim
Patent Images

1. a manufacture method for pre-encapsulating lead frame, is characterized in that:

  • it comprises the following steps;

    (1) first time etching;

    total eclipse is carried out to the front of metal substrate (1) and adds partially-etched two kinds of etching modes quarter, total eclipse is carved and is formed the chip carrier (4) of each load bearing unit, pin (5), seat pillar (6) and middle muscle (7) in order to the etch-hole (3) forming several eating thrown, partially-etched be along in the front (2) of muscle (7) first time of carrying out partially-etched, with a part for muscle (7) thickness in removing;

    (2) encapsulate in advance;

    inject the first plastic part (8) to described etch-hole (3) and middle muscle (7) first time removed region and encapsulate in advance;

    (3) second time etching;

    be along in the back side (10) of muscle (7) second time of carrying out partially-etched, for the remaining part of muscle (7) in removing.

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