Assembling method and manufacturing method and apparatus of flip bare chip, and electronic equipment

Assembling method and manufacturing method and apparatus of flip bare chip, and electronic equipment

  • CN 105,493,257 A
  • Filed: 07/14/2015
  • Published: 04/13/2016
  • Est. Priority Date: 07/14/2015
  • Status: Active Application
First Claim
Patent Images

1. , for a method for assembling upside-down mounting nude film, comprising:

  • By the interim bonding of the first substrate of upside-down mounting nude film and laser-light transparent, wherein, the bump bonding of upside-down mounting nude film is positioned at the side relative with the first substrate of upside-down mounting nude film;

    Bump bonding is aimed at the connection pad received on substrate;

    The first substrate is irradiated, with from the first substrate desquamation upside-down mounting nude film from the first substrate side laser;

    AndBy upside-down mounting die attach to reception substrate, for completing assembling.

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