Copper alloy sheet having excellent conductivity and bending deflection factor

Copper alloy sheet having excellent conductivity and bending deflection factor

  • CN 105,518,166 A
  • Filed: 04/09/2014
  • Published: 04/20/2016
  • Est. Priority Date: 08/13/2013
  • Status: Active Application
First Claim
Patent Images

1. a copper alloy plate, is characterized in that,In Ni and Co containing 0.8 ~ 5.0 quality % more than one, the Si of 0.2 ~ 1.5 quality %, remaining part by copper and inevitably impurity form, have the tensile strength of more than 500MPa, the A value stated by following formula is more than 0.5,A=

  • 2X (111)

    X (220)

    X (200)X (hkl)

    I (hkl)

    I 0(hkl)Wherein, I (hkl)and I 0 (hkl)be respectively and use X-ray diffraction method to the diffraction integral intensity in (hkl) face that calendering face and copper powder are obtained.

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