Printed circuit boards having profiled conductive layer and methods of manufacturing same

Printed circuit boards having profiled conductive layer and methods of manufacturing same

  • CN 105,657,965 A
  • Filed: 12/01/2015
  • Published: 06/08/2016
  • Est. Priority Date: 12/01/2014
  • Status: Active Application
First Claim
Patent Images

1. a multilayer printed circuit board, comprising:

  • Core portion;

    The first conductive layer being coupled to described core portion, described first conductive layer comprises the first part with the first thickness and has the second section of the 2nd thickness, and described 2nd thickness is greater than described first thickness;

    Cover the insulation layer of described first conductive layer;

    AndThe 2nd conductive layer separated by described insulation layer and described first conductive layer, described 2nd conductive layer is electrically coupled to the described second section of described first conductive layer by extend through the conductive path of described insulation layer.

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