Semiconductor module with encapsulating compound made of cement covering the semiconductor component

Semiconductor module with encapsulating compound made of cement covering the semiconductor component

  • CN 105,706,230 B
  • Filed: 10/14/2014
  • Issued: 03/13/2020
  • Est. Priority Date: 11/07/2013
  • Status: Active Grant
First Claim
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1. Semiconductor module (10) having an encapsulating compound (30) covering a semiconductor component (20) fastened to a ceramic substrate (50), the encapsulating compound (30) being designed as a "dome package", wherein the ceramic substrate (50) is applied to an upper side of a heat sink (70), the lower side of which is connected to a heat sink (80), wherein the semiconductor module (10) has a frame (60) as a carrier for an electrical contact which is led to the outside, wherein the encapsulating compound (30) is cement, wherein the cement is made from the base materials magnesium oxide, zirconium silicate and magnesium phosphate, and wherein the further surface regions of the "dome package" and of the semiconductor module (10) are covered by an insulating compound (90).

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