Integrated circuit package element and fabrication method thereof

Integrated circuit package element and fabrication method thereof

  • CN 105,720,021 A
  • Filed: 01/25/2016
  • Published: 06/29/2016
  • Est. Priority Date: 01/25/2016
  • Status: Active Grant
First Claim
Patent Images

1. an ic package, it comprises:

  • Load-carrying unit, it is one in base plate for packaging with lead frame, and described load-carrying unit has the first relative loading end and the second loading end;

    At least one first integrated circuit component, is arranged at the first loading end of described load-carrying unit;

    First injection-moulded housing, is arranged at the first integrated circuit component described in the first loading end of described load-carrying unit and plastic packaging;

    At least one second integrated circuit component, is arranged at the second loading end of described load-carrying unit;

    Some conduction columns, are arranged at the second loading end of described load-carrying unit and are configured to electrically connect with described first integrated circuit component and described second integrated circuit component;

    AndSecond injection-moulded housing, is arranged at the second integrated circuit component described in the second loading end of described load-carrying unit and plastic packaging and described some conduction columns, wherein said conduction column away from the bottom-exposed of described second loading end outside described second injection-moulded housing.

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