Copper-base silver-less and cadmium-less alloy material for low-voltage electrical contact

Copper-base silver-less and cadmium-less alloy material for low-voltage electrical contact

CN
  • CN 1,057,345 C
  • Filed: 10/08/1998
  • Issued: 10/11/2000
  • Est. Priority Date: 10/08/1998
  • Status: Active Grant
First Claim
Patent Images

1. copper-base silver-less and cadmium-less alloy material for low-voltage electrical contact, it conducts electricity the first phase core constituent element is copper, the second phase skeleton constituent element is a diamond, it is characterized in that it is to play to improve electrical contact surface liquid phase and solid phase sticking power that third phase adds constituent element, the formation that reduces surface in contact and contact matrix cracking finally reaches the non-cadmium of reduction electric arc etch and the metallic element or the non-metallic element of cadmium oxide compound with expansion;

  • It is to include a kind of in the combination of following element or element that described third phase adds constituent element;

    be zinc, its proportioning components (weight percent) is diamond 0.2-8%, zinc 0.1-10%, copper surplus;

    Or the combination of tin and indium, its proportioning components (weight percent) is diamond 0.2-8%, tin 0.1-12%, indium 0.1-10%, copper surplus;

    Or chromium, its proportioning components (weight percent) is;

    diamond 0.2-8%, chromium 0.1-10%, copper surplus;

    Or magnesium, its proportioning components (weight percent) is;

    diamond 0.2-8%, magnesium 0.1-10%, copper surplus;

    Or the combination of aluminium and bismuth, its proportioning components (weight percent) is;

    diamond 0.2-8%, aluminium 0.01-5%, bismuth 0.01-5%, copper surplus;

    Or the combination of rubidium and strontium, its proportioning components (weight percent) is;

    diamond 0.2-8%, rubidium 0.01-5%, strontium 0.01-5%, copper surplus;

    Or the combination of yttrium and zirconium, its proportioning components (weight percent) is;

    diamond 0.2-8%, yttrium 0.01-5%, zirconium 0.01-5%, copper surplus;

    Or the combination of silicon and germanium, its proportioning components (weight percent) is;

    diamond 0.2-8%, silicon 0.01-5%, germanium 0.01-5%, copper surplus;

    Or nickel, its proportioning components (weight percent) is;

    diamond 0.2-8%, nickel 0.1-30%, copper surplus;

    Or antimony, its proportioning components (weight percent) is;

    diamond 0.2-8%, antimony 0.01-10%, copper surplus;

    Or the combination of beryllium and niobium, its proportioning components (weight percent) is;

    diamond 0.2-8%, beryllium 0.01-10%, niobium 0.01-5%, copper surplus;

    Or the combination of tungsten and molybdenum, its proportioning components (weight percent) is;

    diamond 0.2-8%, tungsten 0.1-10%, molybdenum 0.1-10%, copper surplus;

    Or the combination of gallium and lanthanum, its proportioning components (weight percent) is;

    diamond 0.2-8%, gallium 0.01-10%, lanthanum 0.01-5, copper surplus.

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