Via hole manufacturing method, array substrate and manufacturing method thereof and display device

Via hole manufacturing method, array substrate and manufacturing method thereof and display device

  • CN 105,789,115 A
  • Filed: 04/26/2016
  • Published: 07/20/2016
  • Est. Priority Date: 04/26/2016
  • Status: Active Application
First Claim
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1. the manufacture method of a via, it is characterised in that including:

  • The first mask plate is adopted to concurrently form the figure of the first via and the figure of the top etching structure of the second via on underlay substrate by patterning processes;

    The second mask plate is adopted to be formed the figure of the second via in the region that the top etching structure figure of described second via formed is corresponding by patterning processes.

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