Moveable edge coupling ring for edge process control during semiconductor wafer processing

Moveable edge coupling ring for edge process control during semiconductor wafer processing

  • CN 105,810,609 A
  • Filed: 01/18/2016
  • Published: 07/27/2016
  • Est. Priority Date: 01/16/2015
  • Status: Active Application
First Claim
Patent Images

1. a lining treatment system, including:

  • Process chamber;

    It is arranged in the pedestal in described process chamber;

    Edge coupling ring, it is arranged adjacent to the radially outward edge of described pedestal;

    AndFirst actuator, it is configured to selectively moved described edge coupling ring to the raised position relative to described pedestal, to provide space between described edge coupling ring and described pedestal, to allow robotic arm to be removed from described process chamber by described edge coupling ring.

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