Surface-treated copper foil, copper foil with carrier, printed wiring board, copper-clad laminate, laminate and method for producing printed wiring board
Surface-treated copper foil, copper foil with carrier, printed wiring board, copper-clad laminate, laminate and method for producing printed wiring board
- CN 105,849,319 A
- Filed: 01/19/2015
- Published: 08/10/2016
- Est. Priority Date: 01/17/2014
- Status: Active Application
- EN CH
-
- Pin
