Surface-treated copper foil, copper foil with carrier, printed wiring board, copper-clad laminate, laminate and method for producing printed wiring board

Surface-treated copper foil, copper foil with carrier, printed wiring board, copper-clad laminate, laminate and method for producing printed wiring board

  • CN 105,849,319 A
  • Filed: 01/19/2015
  • Published: 08/10/2016
  • Est. Priority Date: 01/17/2014
  • Status: Active Application
First Claim
Patent Images

1. a surface treatment copper foil, is formed with surface-treated layer on Copper Foil, when from the table being formed with this surface-treated layerFace be opposition side surface with the copper dissolution etching solution of hydrogen peroxide/sulfuric acid system carry out spraying etching time, make the thickness of this Copper FoilWhen spending the situation that etch-rate is 1 in direction, the etch-rate of the thickness direction of this surface-treated layer is more than 0.5.

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