Workpiece, preparation method thereof and electronic equipment containing the workpiece

Workpiece, preparation method thereof and electronic equipment containing the workpiece

  • CN 105,856,661 A
  • Filed: 02/20/2012
  • Published: 08/17/2016
  • Est. Priority Date: 02/20/2012
  • Status: Active Application
First Claim
Patent Images

1. a workpiece, it is characterised in that including:

  • First surface layer;

    Laminboard layer, is arranged on below described first surface layer;

    Second surface layer, is arranged on below described laminboard layer;

    Wherein, described first surface layer and described second surface layer are band-shaped by the preimpregnation of at least two-layer respectivelyBecome;

    Described prepreg tape is dried by the first material being soaked with thermosetting resin in advance and is formed;

    Described sandwichLayer is formed by second material with some micropores;

    The thickness of described workpiece is 0.7~

    1mm.

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