Conducting cylinder, manufacturing method thereof, chip packaging method and flip chip product

Conducting cylinder, manufacturing method thereof, chip packaging method and flip chip product

  • CN 105,870,093 A
  • Filed: 05/25/2016
  • Published: 08/17/2016
  • Est. Priority Date: 05/25/2016
  • Status: Active Application
First Claim
Patent Images

1. the method manufacturing conductor pin, comprises the following steps:

  • S1;

    use target, the hole wall in hole to the surface of chip electrode or being formed in chip or the circuit of base plate for packagingSurface carries out ion implanting and/or plasma-deposited process, to form conductive seed layer;

    AndS2;

    shape pillared conductor thickening layer above described conductive seed layer, described conductor thickening layer and described conduction seedCrystal layer forms described conductor pin.

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