Multi-stage magnetic field arc ion plating method for lining positive bias straight pipe

Multi-stage magnetic field arc ion plating method for lining positive bias straight pipe

  • CN 105,925,940 A
  • Filed: 06/12/2016
  • Published: 09/07/2016
  • Est. Priority Date: 06/12/2016
  • Status: Active Application
First Claim
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1. the multi-stage magnetic field arc ions electroplating method of liner positive bias straight tube, it is characterized in that, the used device of the method includes grid bias power supply 1, arc power 2, arc ion plating target source 3, multi-stage magnetic field device 4, multi-stage magnetic field power supply 5, liner positive bias hose straightening device 6, positive bias power supply 7, sample stage 8, grid bias power supply kymographion 9 and vacuum chamber 10;

  • The method comprises the following steps;

    Step one, pending substrate work-piece is placed on the sample stage 8 in vacuum chamber 10, workpiece connects the outfan of grid bias power supply 1, the arc ion plating target source 3 being arranged on vacuum chamber 10 connects the outfan of arc power 2, the magnetic fields at different levels of multi-stage magnetic field device 4 connect each outfan of multi-stage magnetic field power supply 5, liner positive bias hose straightening device 6 connects the outfan of positive bias power supply 7, insulate between liner positive bias hose straightening device 6 and vacuum chamber 10 and multi-stage magnetic field device 4;

    Step 2, thin film deposition;

    by vacuum chamber 10 evacuation, treat that the vacuum in vacuum chamber 10 is less than 10-4During Pa, it is passed through working gas to 0.01Pa~

    10Pa, open grid bias power supply 1 and grid bias power supply kymographion 9, and regulate the bias amplitude of grid bias power supply 1 output, pulse frequency and pulse width, it is 0~

    1.2kV that grid bias power supply 1 exports the peak voltage of pulse, and pulse frequency is 0Hz~

    80kHz, pulse width 1 ~ 90%;

    Open arc power 2, by the spots moving of electric arc, the surface in arc ion plating target source 3 is carried out, the technological parameter that regulation needs, the current value of arc power 2 output is 10 ~ 300A, multi-stage magnetic field device 4 is regulated by multi-stage magnetic field power supply 5, keep arc-plasma in the stable generation in arc ion plating target source 3 and to carry out bulky grain defect filtering elimination, make arc-plasma arrive matrix surface with higher efficiency of transmission by multi-stage magnetic field device 4, carry out the fast deposition of thin film;

    nullOpen positive bias power supply 7,

    Liner positive bias hose straightening device 6 is kept direct current positive bias,

    Adjust output voltage,

    Make liner positive bias hose straightening device 6 that bulky grain to be attracted,

    Depositing ions is repelled,

    Reduce plasma loss in pipe in transmitting procedure,

    Improve efficiency of transmission and the deposition velocity of thin film of plasma,

    Between liner positive bias hose straightening device 6 and multi-stage magnetic field device 4, movable insulation is connected,

    Liner positive bias hose straightening device 6 can be dismantled cleaning in time and install with apparent surface pollution level,

    Avoid the problem that the inside pipe wall of multi-stage magnetic field device 4 under linerless board status pollutes and is difficult to cleaning,

    The internal diameter of liner positive bias hose straightening device 6 is more than the external diameter in arc ion plating target source 3,

    The external diameter of liner positive bias hose straightening device 6 is less than the internal diameter of multi-stage magnetic field device 4,

    Material may select nonmagnetic、

    304 stainless steel materials of resistance to cleaning,

    The parameter of positive bias power supply 7 is 0 ~+200V,

    For DC voltage,

    In deposition process, bulky grain defect can be produced continual and steady attraction,

    Greatly reduce bulky grain and arrived the probability of film surface by multi-stage magnetic field device 4.

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