To-be-encapsulated substrate, encapsulating method, encapsulating structure and display device

To-be-encapsulated substrate, encapsulating method, encapsulating structure and display device

  • CN 105,932,175 A
  • Filed: 06/28/2016
  • Published: 09/07/2016
  • Est. Priority Date: 06/28/2016
  • Status: Active Application
First Claim
Patent Images

1. a substrate to be packaged, including first surface, is formed with sealed plastic box on the first surface,It is characterized in that, described sealed plastic box includes:

  • The sealed plastic box main part formed around the surrounding of described first surface;

    And, formed in the precalculated position of described sealed plastic box main part is sharp for start for laser scanningOptical scanning initial part and the laser scanning end portion terminated for confession laser scanning, described laser scanning initial partOutside all protruding from described sealed plastic box main part with described laser scanning end portion, and with described sealed plastic box main bodyPortion is connected.

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