Substrate, packaging method, encapsulating structure and display device to be packaged

Substrate, packaging method, encapsulating structure and display device to be packaged

  • CN 105,932,175 B
  • Filed: 06/28/2016
  • Issued: 04/23/2019
  • Est. Priority Date: 06/28/2016
  • Status: Active Grant
First Claim
Patent Images

1. a kind of substrate to be packaged, including first surface, are formed with sealant on the first surface, which is characterized in that instituteStating sealant includes:

  • The sealant main part formed around the surrounding of the first surface;

    And the starting of the laser scanning for starting for laser scanning is formed by the predetermined position of the sealant main partPortion and laser scanning end portion for being terminated for laser scanning, the laser scanning initial part and the laser scanning end portionIt protrudes from except the sealant main part, and is connected with the sealant main part;

    The sealant main part includes ringBe wound on the surrounding of the first surface and along laser scanning direction set gradually first while, second while, third while and when the 4th;

    Wherein the predetermined position be described first while and it is described 4th while the position that overlaps;

    On the first surface with the envelope frameOne is formed on position corresponding to the predetermined position of glue main part to be recessed inwardly the buffer groove to be formed.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×