Method for packaging liquid metal printed circuit by using light-cured resin

Method for packaging liquid metal printed circuit by using light-cured resin

  • CN 105,934,105 B
  • Filed: 04/29/2016
  • Issued: 08/04/2020
  • Est. Priority Date: 04/29/2016
  • Status: Active Grant
First Claim
Patent Images

1. A method of encapsulating a liquid metal printed circuit with a light-curable resin, comprising the steps of:

  • 1) the printed circuit to be packaged is a printed circuit with liquid metal as a lead, a light-cured resin in a liquid state is coated or adhered on the surface of the liquid metal printed circuit by using a glue dispensing device, the liquid metal printed circuit is adhered on a substrate, the light-cured resin in the liquid state is further coated or adhered on the position of the substrate, which is not adhered by the liquid metal lead, and the thickness of the resin is adjusted according to the packaging requirement;

    2) the irradiation machine irradiates light to the light-cured resin on the surface of the liquid metal printed circuit, the irradiated light-cured resin is converted into a solid state from a liquid state through a chemical reaction, is tightly combined with the liquid metal printed circuit and covers the liquid metal lead to form protection on the lead, and packaging of the liquid metal printed circuit is realized;

    the uncured photocurable resin portion is removed using an organic solvent after the irradiation is completed.

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