Smart card and manufacturing method thereof

Smart card and manufacturing method thereof

  • CN 105,956,653 B
  • Filed: 05/03/2016
  • Issued: 10/13/2020
  • Est. Priority Date: 05/03/2016
  • Status: Active Grant
First Claim
Patent Images

1. A method of manufacturing a smart card, comprising:

  • step s 1;

    mounting the IC module to a circuit board;

    placing a conductive medium on a plurality of pads of a contact area of the circuit board;

    filling the circuit board mounted with the IC module into the first substrate;

    embedding a wire in the first substrate and winding into an antenna coil;

    step s 2;

    welding two ends of the antenna coil to the circuit board, so that the antenna coil is connected with the IC module through the circuit board;

    step s 3;

    attaching a second substrate and/or a film on the first substrate, and laminating to obtain a medium material;

    step s 4;

    milling a groove on the middle material according to the position of the bonding pad in the contact area, so that the conductive medium on the bonding pad in the contact area can be seen at the bottom of the groove;

    step s 5;

    filling a carrier tape unit into the groove, assembling the carrier tape unit on the circuit board through a conductive medium on a welding disc in a contact area of the circuit board, and connecting the carrier tape unit with the IC module through the circuit board to obtain an intelligent card;

    the circuit board further comprises;

    a chip region and a non-connection region;

    the chip area and the contact area are electrically connected, and the chip area and the non-connection area are electrically connected;

    the assembling of the IC module on the circuit board specifically comprises;

    mounting the IC module in the chip area of the circuit board;

    welding the two ends of the antenna coil to the circuit board specifically comprises the following steps; and

    welding two ends of the antenna coil into the non-connection area of the circuit board, so that the antenna coil is connected with the IC module through the circuit board.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×