Method of manufacturing printed circuit board and method of inspecting printed circuit board

Method of manufacturing printed circuit board and method of inspecting printed circuit board

  • CN 105,979,695 A
  • Filed: 03/11/2016
  • Published: 09/28/2016
  • Est. Priority Date: 03/12/2015
  • Status: Active Application
First Claim
Patent Images

1. a manufacture method for wired circuit board, comprises the following steps:

  • Making wired circuit board, this wired circuit board includes metal support substrate, the first insulation successivelyLayer, wiring pattern and the second insulating barrier;

    AndCarry out the inspection of described wired circuit board,Wherein, comprise the following steps in the step making described wired circuit board;

    make exhausted by firstEdge material forms described first insulating barrier and the first wired circuit board of described second insulating barrier, or systemMake to be formed described first insulating barrier and the second wired circuit of described second insulating barrier by the second insulantSubstrate,The step carrying out described inspection comprises the following steps;

    When described first wired circuit board is checked, will have peak value in first wave length regionFirst light of wavelength is irradiated to described first wired circuit board, is entering described second wired circuit boardWhen row checks, in the second wave length region different from described first wave length region, will there is peak wavelengthSecond light is irradiated to described second wired circuit board;

    When described first wired circuit board is checked, based on from described first wired circuit boardThe reflection light that reflection comes generates the image of described first wired circuit board, to described second wiring electricityWhen base board checks, generate institute based on the reflection light come from described second wired circuit board reflectionState the image of the second wired circuit board;

    AndWhen described first wired circuit board is checked, based on described first wired circuit boardImage judges that described wiring pattern is the best, is checking described second wired circuit boardTime, image based on described second wired circuit board judges that described wiring pattern is the best,Wherein, will be reflected by described wiring pattern and from the light of described wired circuit board outgoing with incideRatio between the light of described wired circuit board is defined as connecting up reflectance, will by described metal supportSubstrate reflection and from the light of described wired circuit board outgoing with incided described wired circuit boardRatio between light is defined as substrate reflectivity,Described first wired circuit board has following characteristic;

    the described wiring for described first light is anti-Penetrate difference between rate and described substrate reflectivity more than for described second light described wiring reflectance withDifference between described substrate reflectivity,Described second wired circuit board has following characteristic;

    the described wiring for described second light is anti-Penetrate difference between rate and described substrate reflectivity more than for described first light described wiring reflectance with Difference between described substrate reflectivity.

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