Method for manufacturing printed circuit board and method for inspecting printed circuit board

Method for manufacturing printed circuit board and method for inspecting printed circuit board

  • CN 105,979,695 B
  • Filed: 03/11/2016
  • Issued: 12/08/2020
  • Est. Priority Date: 03/12/2015
  • Status: Active Grant
First Claim
Patent Images

1. A method of manufacturing a wired circuit board, comprising the steps of:

  • manufacturing a wired circuit substrate which sequentially comprises a metal supporting substrate, a first insulating layer, a wiring pattern and a second insulating layer; and

    the inspection of the wired circuit board is performed,wherein the step of manufacturing the wired circuit board includes the steps of;

    fabricating a first wired circuit substrate in which the first insulating layer and the second insulating layer are formed of a first insulating material, and fabricating a second wired circuit substrate in which the first insulating layer and the second insulating layer are formed of a second insulating material,the step of performing said check comprises the steps of;

    irradiating the first wired circuit board with first light having a peak wavelength in a first wavelength region when the first wired circuit board is inspected, and irradiating the second wired circuit board with second light having a peak wavelength in a second wavelength region different from the first wavelength region when the second wired circuit board is inspected;

    generating an image of the first wired circuit board based on reflected light reflected from the first wired circuit board at the time of inspection of the first wired circuit board, and generating an image of the second wired circuit board based on reflected light reflected from the second wired circuit board at the time of inspection of the second wired circuit board; and

    determining whether the wiring pattern is good or not based on the image of the first wired circuit board when the first wired circuit board is inspected, and determining whether the wiring pattern is good or not based on the image of the second wired circuit board when the second wired circuit board is inspected,wherein a ratio between light reflected by the wiring pattern and emitted from the wired circuit board and light incident on the wired circuit board is defined as wiring reflectance, a ratio between light reflected by the metal supporting substrate and emitted from the wired circuit board and light incident on the wired circuit board is defined as substrate reflectance,the first wired circuit board has the following characteristics;

    a difference between the wiring reflectivity and the substrate reflectivity for the first light is greater than a difference between the wiring reflectivity and the substrate reflectivity for the second light,the second wired circuit board has the following characteristics;

    a difference between the wiring reflectivity and the substrate reflectivity for the second light is greater than a difference between the wiring reflectivity and the substrate reflectivity for the first light,the first wavelength region is 425nm to 525nm inclusive, the second wavelength region is 630nm to 850nm inclusive,irradiating the first light to the first wired circuit board through a first light emitting element generating violet light or blue light, irradiating the second light to the second wired circuit board through a second light emitting element generating red light or infrared light, andthe first insulating material has a higher transmittance of light than the second insulating material with respect to each wavelength in a range of 425nm or more and 850nm or less.

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