Non-vertical through-via in package

Non-vertical through-via in package

  • CN 105,990,290 A
  • Filed: 09/30/2015
  • Published: 10/05/2016
  • Est. Priority Date: 03/16/2015
  • Status: Active Grant
First Claim
Patent Images

1. a packaging part, comprising:

  • Component pipe core;

    Through hole, wherein, described through hole has hourglass profile;

    Moulding material, moulds described component pipe core and described through hole in described moulding material, wherein,The end face of described moulding material is substantially flush with the end face of described component pipe core;

    Dielectric layer, covers described moulding material and described component pipe core;

    AndA plurality of redistribution lines (RDL), extends in described dielectric layer, to be electrically coupled to described deviceTube core and described through hole.

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