Solder in Cavity Interconnection Technology

Solder in Cavity Interconnection Technology

  • CN 106,024,743 A
  • Filed: 12/21/2010
  • Published: 10/12/2016
  • Est. Priority Date: 12/21/2009
  • Status: Active Application
First Claim
Patent Images

1. a method, including:

  • Forming electric component, wherein solder projection is fixed to soldered ball so that the opposite face of described soldered ball is less than or equal to the opposite face of described solder projection.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×