Method for embedding a component in a printed circuit board

Method for embedding a component in a printed circuit board

  • CN 106,063,387 A
  • Filed: 12/12/2014
  • Published: 10/26/2016
  • Est. Priority Date: 12/12/2013
  • Status: Active Application
First Claim
Patent Images

1. method, it is for by Component Embedding printed circuit board (PCB) or printed circuit boards half-finished product, wherein this printed circuit board (PCB) or printPrinted circuit board semi-finished product comprise the insulating barrier of at least one of which pre-preg material, and this component is by the resin of this pre-preg materialFix;

  • It is characterized in that following steps;

    A) providing the combination (100) of the layer of printed circuit board (PCB) or printed circuit boards half-finished product (200), wherein this combination includes at leastOne layer of curable pre-preg material;

    B) in this combination (100), gap (4) is created, to accommodate component (6) to be embedded;

    C) on the first side of combination, the scope of at least this gap (4) is covered with the first temporary carrier layer (5);

    D) component (6) that will be embedded by this first temporary carrier layer (5) is positioned in this gap (4);

    E) on the second side of combination (100), the scope of at least this gap (4) is covered with the second temporary carrier layer (9);

    F) will have combination (100) compression of this component (6), the pre-preg material solidification curable by this;

    AndG) those temporary carrier layers (5,9) are removed.

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